PCB Capabilities

PCB

Item Content Maximum
Layer Layer count 12L
HDI AVAILABLE
Pattern Pattern width / spacing 3.0mil / 3.0mil
Process capability Tolerance of Board Thickness 3.0 mil
Layer to layer registation 1.5mil
True position tolerance 1.5mil
Min finished hole size 6.0mil
Aspect ratio  (H:T) 0.15:10
Copper plating uniformity R≦0.20mil
PAD to line spacing  3.0mil
Min. S / M dam  MIN:3.0mil
Legend width MIN:3.0mil
Heavy Copper (OZ) 4 oZ
Surface finish Gold plating
ENIG
OSP
HASL
Carbon
Immersion silver
Immersion tin
Resin plugging / cap plating